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CVD Equipment Product List and Ranking from 21 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

CVD Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. サムコ Kyoto//Industrial Machinery
  2. 天谷製作所 Saitama//Industrial Machinery
  3. アリオス Tokyo//Industrial Machinery
  4. 4 ジャパンクリエイト Saitama//Testing, Analysis and Measurement
  5. 5 ハイテック・システムズ Kanagawa//Industrial Machinery
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CVD Equipment Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. CVD Equipment for Synthesizing Single Crystal High Purity Diamonds DCVD-51A アリオス
  2. Plasma CVD equipment for thick film formation of SiO2 サムコ
  3. CVD・MOCVD customized equipment ハイテック・システムズ
  4. Atmospheric Pressure CVD Equipment "AMAX800V" 天谷製作所
  5. [Data] Silicon processing data using the non-bosch process サムコ

CVD Equipment Product List

1～15 item / All 41 items

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Plasma CVD equipment for thick film formation of SiO2

Plasma CVD equipment for thick film formation of SiO2

Plasma CVD device for thick film formation. High speed and low stress (patent pending).

● The adoption of a unique self-bias method enables high-speed (3000-5000 Å/min) and low-stress film deposition. (Patent pending) ● Low-temperature film deposition is possible at room temperature to about 350°C. Additionally, film deposition on plastics is feasible. ● Unique modifications in the reaction chamber help suppress particle generation. ● The LS-CVD method using liquid source TEOS allows for excellent step coverage and filling effects in film deposition. ● Arbitrary control of the refractive index is possible using liquid sources of Ge, P, and B. In addition to the standard one series, it is possible to add two more series of dopant introduction systems as options.

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Plasma CVD equipment

Plasma CVD equipment

Plasma CVD equipment

● Despite its compact design, it can accommodate 5 pieces of 3-inch wafers, 3 pieces of 4-inch wafers, and 1 piece of 8-inch wafers. ● Up to 100-step processes are possible. ● Equipped with a load lock chamber, enabling stable processes. ● Features an interlock mechanism for various safety measures.

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[Data] Silicon processing data using the non-bosch process

[Data] Silicon processing data using the non-bosch process

We are publishing new data on the non-bosch process for silicon.

This document introduces silicon processing data using the non-Bosch process. It includes results of silicon etching processed with the non-Bosch process using the RIE-800iP. Please take a moment to read it. 【Contents】 ■ Process ■ High aspect ratio Bosch process results ■ Sequential taper shape processing results ■ SEM results of silicon sidewall observation *For more details, please refer to the PDF document or feel free to contact us.

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[Data] - Example of ICP Etching Process for MicroLEDs

[Data] - Example of ICP Etching Process for MicroLEDs

As a result of GaN microLED mesa processing, we have published emission spectral data during the GaN microLED mesa processing!

This document introduces examples of ICP etching for microLEDs. As part of the experiments and results, it includes the outcomes of GaN microLED mesa processing and the photoluminescence spectral data during the GaN microLED mesa processing. Please take a moment to read it. 【Contents】 ■ Experiments and Results ■ Results of GaN MicroLED Mesa Processing ■ Photoluminescence Spectral Data During GaN MicroLED Mesa Processing ■ Summary *For more details, please refer to the PDF document or feel free to contact us.

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Plasma CVD device for PET bottles

Plasma CVD device for PET bottles

Coating is possible up to a 3L container! It contributes to reducing logistics costs through lightweight containers.

This product is a film deposition device specialized for DLC coating on "PET bottles," which are commonly used as resin container materials, utilizing the plasma CVD process technology that our company excels in. By applying a sub-micron order DLC thin film coating to the inner surface of PET bottles, it contributes to preventing flavor deterioration due to oxidation of the contents, preventing the leaching of carbonated components, and reducing logistics costs through container weight reduction. 【Features】 - Various equipment configurations can be proposed based on the required production quantity. - Coating is possible for containers up to 3L. - Please consult us regarding containers larger than 3L. - Please consult us regarding resin materials other than PET. - Please consult us regarding metal materials. *For more details, please refer to the PDF document or feel free to contact us.

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CVD・MOCVD customized equipment

CVD・MOCVD customized equipment

Various plasma sources can be equipped! Customized design for CVD, MOCVD, and ALD equipment.

We handle "CVD and MOCVD customized equipment" designed for research and development as well as small-scale batch production. CVD, MOCVD, and ALD equipment can be customized, and a variety of plasma sources from the PLUM, FLARION, and MIRENIQUE series can be installed. Additionally, it is equipped with the FLOCON series flow management system. 【Features】 ■ Equipment for research and development or small-scale batch production ■ Customized design for CVD, MOCVD, and ALD equipment ■ Variety of plasma sources from the PLUM, FLARION, and MIRENIQUE series can be installed ■ Equipped with the FLOCON series flow management system *For more details, please refer to the PDF document or feel free to contact us.

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Plasma CVD Equipment Concept-150/200

Plasma CVD Equipment Concept-150/200

With a space-saving design, the vacuum pump module can be installed up to 18 meters away from the process module.

This device is compatible with 4, 5, 6, and 8-inch wafers and is designed to form silicon oxide and silicon nitride films on the wafers using the plasma CVD method. The basic configuration consists of three modules: a process module, an RF generator module (one set each for high frequency and low frequency), and a vacuum pump module.

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Liquid Source Plasma CVD Equipment

Liquid Source Plasma CVD Equipment

A compact and space-efficient device! The substrate supports φ4 inch, and it comes with a heating mechanism and T/S variable mechanism!

This product is a plasma CVD device with a cylinder cabinet designed for liquid raw material sources, including TEOS. It is equipped with a bakeable MFC compatible with liquid sources and various baking mechanisms, and features a uniquely designed plasma electrode to prevent internal abnormal discharges and ensure stable plasma generation. The device allows for substrate replacement and internal maintenance through the opening and closing of the top cover, and it is compact with excellent space efficiency. 【Features】 ■ Equipped with a cylinder cabinet ■ Includes a bakeable MFC compatible with liquid sources and various baking mechanisms ■ Designed with a unique plasma electrode ■ Allows for substrate replacement and internal maintenance through the opening and closing of the top cover ■ Compact and space-efficient *For more details, please refer to the PDF materials or feel free to contact us.

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SFCV Series Small Thermal CVD Device for Graphene Development

SFCV Series Small Thermal CVD Device for Graphene Development

High-temperature thermal CVD equipment of tubular furnace type suitable for various material development using hydrocarbon-based compounds such as graphene at universities and research institutions.

We have miniaturized the test pieces to allow for easy operation in producing small quantities and sizes, while simultaneously achieving significant cost reductions. Additionally, we have equipped them with pressure control functionality in the range of 5 to 100 Pa, which was previously considered difficult for small sizes, enabling support for a wider variety of processing patterns. Furthermore, for flammable gases based on hydrocarbons, we have safety devices such as equipment shutdown triggered by alarm detection and atmospheric gas dilution units. For more details, please download the catalog or contact us.

  • Vacuum Equipment
  • Heating device
  • Testing Equipment and Devices

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CVD Equipment for Synthesizing Single Crystal High Purity Diamonds DCVD-51A

CVD Equipment for Synthesizing Single Crystal High Purity Diamonds DCVD-51A

Compact and energy-efficient! Plasma CVD equipment for synthesizing single crystal high-purity diamonds for device fabrication.

Plasma CVD equipment for conducting high-purity diamond synthesis experiments capable of single crystal diamond growth (homoepitaxial). 【Features】 ○ Compact and energy-efficient ○ Utilizes ultra-high vacuum technology, ensuring that the plasma does not contact the chamber walls, allowing for single crystal high-purity diamond synthesis experiments suitable for device fabrication ○ Spherical compact chamber and special electrodes enable high-efficiency operation ○ Experiments can be conducted while observing the discharge state ○ Sample introduction can be developed into a load-lock system ○ Complete shielding structure ensures excellent microwave leakage prevention ○ Operates solely on power and gas supply due to all air-cooled specifications ● For other functions and details, please download the catalog.

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[Nanofurnace] BWS-NANO Thermal CVD Device

[Nanofurnace] BWS-NANO Thermal CVD Device

Hot Wall Type Thermal CVD Equipment: A compact, high-performance CVD device ideal for fundamental research.

◉ Graphene, carbon nanotubes ◉ ZnO nanowires ◉ Insulating films such as SiO2 Others, compatible with a wide range of applications as a hot-wall thermal CVD system.

  • CVD Equipment
  • Annealing furnace
  • Heating device

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Single-wafer atmospheric pressure CVD device 'A200V'

Single-wafer atmospheric pressure CVD device 'A200V'

Compact the device size as much as possible! Achieve stable film formation and low particle count.

The "A200V" is a single-wafer atmospheric pressure CVD system compatible with φ150 and φ200 mm wafers, covering production from small quantities of diverse products to mass production. By adopting a face-down film formation method, it demonstrates excellent film thickness uniformity, particle control, and embedding performance, depositing silicon oxide films based on SiH4. Additionally, the system can also support options for TEOS-O3 and SiH4-O3. 【Features】 ■ Face-down position ■ Compact device design and configuration ■ Balancing maintainability and high productivity ■ Excellent film thickness uniformity and embedding capability ■ Ensures safety by preventing operators from directly contacting the heating area *For more details, please refer to the PDF materials or feel free to contact us.

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Vertical Reduced Pressure CVD Apparatus

Vertical Reduced Pressure CVD Apparatus

More than 10 types of semiconductor gases can be freely controlled! Customizable.

Supports various uses such as vertical type, sheet, wafer size, gas type, and footprint. This is a high-grade vertical reduced pressure CVD system focused on versatility. It can also be customized based on standard specifications to be manufactured at a lower cost. 【Features】 ■ Supports wafer sizes of 3", 6", and 8" with a small footprint ■ Reduces natural oxidation with heater lifting function ■ Achieves stable temperature control from room temperature to 900℃ *For more details, please contact us or download the PDF for more information.

  • Other semiconductor manufacturing equipment

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Plasma CVD device "PEGASUS"

Plasma CVD device "PEGASUS"

Low-temperature film formation. High insulation, high barrier, uniformity!

"PEGASUS" is a mass production-compatible plasma CVD device that enables the formation process of insulating films and protective films for memory, power devices, and MEMS with precise and stable film deposition at low temperatures. It features a high level of safety due to its interlock mechanism and prevents contamination from the backside by using non-metal materials at the wafer contact points. 【Features】 ■ Low-temperature film deposition ■ Maintenance-friendly ■ Wafer handling ■ Footprint ■ Maintenance support, etc. *For more details, please download the PDF or feel free to contact us.

  • Plasma surface treatment equipment

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Agnitron Corporation Used Refurbished MOCVD Equipment

Agnitron Corporation Used Refurbished MOCVD Equipment

We provide fully refurbished and upgraded legacy MOCVD equipment along with the best service and support.

Agnitron is well-versed in the usage history and features of used equipment, and carries out the refurbishment and upgrades of used equipment to meet customer needs. Additionally, they are knowledgeable in materials science and process engineering, ensuring that they not only focus on the engineering of the equipment but also understand how the past usage history of the equipment can affect future performance, the feasibility of reusing parts, and the appropriate timing for replacements, allowing customers to purchase and use the equipment with confidence. (1) New functions can be added through standard and optional upgrades. (2) Provision of parts and services. (3) Flexible response to various customer demands. (4) Epoxy inspection guarantees available as an option.

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